The largest foundry in the world is Taiwan Semiconductor Manufacturing Company, Limited (TSMC). Both Samsung and Samsung are shipping chips made with their 3nm process node this year. The smaller the process node, the higher the number of transistors in chips. Since the iPhone 14 series is expected to be released around the second week of September, Apple will use the 4nm A16 Bionic to power the expensive Pro models, while the currently used 5nm A15 Bionic chip will be used on the iPhone 14 series. non-Pro models.
Samsung has already started shipping chips made with its 3nm process node
The reason this is important is that the greater the number of transistors, the more powerful and energy-efficient a chip is. Samsung Foundry has already started shipping 3nm chips this year, but only for cryptocurrency miners. TSMC will also ship 3nm chips this year, and with Apple being the company’s largest customer, you’d expect the tech giant to be the first to receive N3 chips from TSMC when they start shipping later this year. N3 is the designation for TSMC’s first generation 3nm chips.
TSMC will reportedly ship its first 3nm chips to Apple later this year
When can we expect TSMC to start producing 2nm chips?
So what happens after 3nm? Last April, CC Wei, CEO of TSMC, said the goal is for TSMC to start shipping 2nm chips by 2026, making 3nm “a long node”. Most nodes last two years. While TSMC still uses FinFET transistors at 3nm, it will switch to Gate-All-Around for 2nm, a move Samsung already made with its 3nm node. Both foundries will continue to use Extreme Ultraviolet Lithography (EUV) at their 3nm nodes to etch the circuitry patterns thinner than hair on the wafers that become chips.
But let’s not get ahead of ourselves. TSMC says its 3nm FinFET chips will reduce power consumption by 25-30% at the same speed, and increase speed by 10-15% at the same amount of power compared to the previous 5nm FinFET chips. Samsung has said its 3nm process node will reduce power consumption by 45% and improve performance by 23%.
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